Description The BIHUI 50mm Mini Polishing Pads are mini diamond polishing pads designed for use with the BIHUI Long Neck Mini Angle Grinder in conjunction with the BIHUI 50mm Velcro Pad Attachment. Available in 3 types: resin-bonded hexagonal block for dry polishing, resin-bonded square block for wet polishing and electroplated diamond for material removal. Each type is available in 4 grit levels: 50, 100, 200 and 400. (The electroplated pads are available in 60, 120, 200 and 400 grit). The resin-bonded diamond BIHUI 50mm Mini Polishing Pads are specifically designed for refining surfaces, with choices in shape (hexagonal vs. square) and application method (wet vs. dry) significantly impacting performance and finish. The Hexagonal pattern pads are designed for dry use to optimize airflow and cooling for faster, cooler cutting, while the square pattern pads are designed for wet use for consistent, flat polishing. Wet pads are generally used for a superior, mirror-like, scratch-free finish, while dry pads offer convenience and speed on job sites where water is impractical. Click here to view the manufacturers website.
